Adhesive Bonding of Copper Prepared by Laser-Interference near the Interference Structuring Limits

Adhesive bonding requires adequate surface preparation for ensuring an appropriate joint quality. The interest in adhesive joining has recently expanded to thermal systems having a large number of joints employed for manufacturing and assembly. This study presents surface topology of copper 110 prod...

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Detalles Bibliográficos
Autores principales: Liu, Haotian, Weibel, Justin A., Sabau, Adrian S., Geoghegan, Patrick, Chen, Jian, Groll, Eckhard A.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8269532/
https://www.ncbi.nlm.nih.gov/pubmed/34201495
http://dx.doi.org/10.3390/ma14133485

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8269532/
https://www.ncbi.nlm.nih.gov/pubmed/34201495
http://dx.doi.org/10.3390/ma14133485

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