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Adhesive Bonding of Copper Prepared by Laser-Interference near the Interference Structuring Limits
Adhesive bonding requires adequate surface preparation for ensuring an appropriate joint quality. The interest in adhesive joining has recently expanded to thermal systems having a large number of joints employed for manufacturing and assembly. This study presents surface topology of copper 110 prod...
| Autores principales: | , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2021
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8269532/ https://www.ncbi.nlm.nih.gov/pubmed/34201495 http://dx.doi.org/10.3390/ma14133485 |