A Comparative Study of Thermal Aging Effect on the Properties of Silicone-Based and Silicone-Free Thermal Gap Filler Materials

Thermal conductive gap filler materials are used as thermal interface materials (TIMs) in electronic devices due their numerous advantages, such as higher thermal conductivity, ease of use, and conformity. Silicone is a class of synthetic materials based on a polymeric siloxane backbone which is wid...

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Detalles Bibliográficos
Autores principales: Chowdhury, A S M Raufur, Rabby, Monjur Morshed, Kabir, Mehzabeen, Das, Partha Pratim, Bhandari, Rabin, Raihan, Rassel, Agonafer, Dereje
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8269627/
https://www.ncbi.nlm.nih.gov/pubmed/34202198
http://dx.doi.org/10.3390/ma14133565

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8269627/
https://www.ncbi.nlm.nih.gov/pubmed/34202198
http://dx.doi.org/10.3390/ma14133565

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