Thermally-Induced Deformations and Warpages of Flip-Chip and 2.5D IC Packages Measured by Strain Gauges

The thermal warpage problems in integrated circuit (IC) packaging exist in both flip-chip and two-and-a-half dimensional integrated circuits (2.5D IC) packages during manufacturing processes and thermal cycling service. This study proposes a simple and easy-to-use strain gauge measurement associated...

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Detalles Bibliográficos
Autores principales: Tsai, Ming-Yi, Wang, Yu-Wen, Liu, Chia-Ming
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8269881/
https://www.ncbi.nlm.nih.gov/pubmed/34279290
http://dx.doi.org/10.3390/ma14133723

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8269881/
https://www.ncbi.nlm.nih.gov/pubmed/34279290
http://dx.doi.org/10.3390/ma14133723

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