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Thermally-Induced Deformations and Warpages of Flip-Chip and 2.5D IC Packages Measured by Strain Gauges

The thermal warpage problems in integrated circuit (IC) packaging exist in both flip-chip and two-and-a-half dimensional integrated circuits (2.5D IC) packages during manufacturing processes and thermal cycling service. This study proposes a simple and easy-to-use strain gauge measurement associated...

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Detalles Bibliográficos
Autores principales: Tsai, Ming-Yi, Wang, Yu-Wen, Liu, Chia-Ming
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8269881/
https://www.ncbi.nlm.nih.gov/pubmed/34279290
http://dx.doi.org/10.3390/ma14133723
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author Tsai, Ming-Yi
Wang, Yu-Wen
Liu, Chia-Ming
author_facet Tsai, Ming-Yi
Wang, Yu-Wen
Liu, Chia-Ming
author_sort Tsai, Ming-Yi
collection PubMed
description The thermal warpage problems in integrated circuit (IC) packaging exist in both flip-chip and two-and-a-half dimensional integrated circuits (2.5D IC) packages during manufacturing processes and thermal cycling service. This study proposes a simple and easy-to-use strain gauge measurement associated with a beam model theory to determine the thermally induced deformations and warpages of both packages. First, validation and limitations of the beam model theory are presented. Then, the thermally induced out-of-plane deformations for both packages are well described by the finite element method (FEM) simulation with a good consistency to full-field shadow moiré experimental results. The strain gauge measurements were implemented experimentally, and the thermal strain results were found to be well consistent with validated FEM ones. As a result, out-of-plane thermal deformations and warpages of the packages, calculated from the beam model theory with extracted curvature data from the strain gauge, were in reasonably good agreement with those from FEM analysis and shadow moiré measurements. Therefore, the strain gauge method of featuring point strain measurement combined with the beam model theory proved feasible in determining the thermal deformations and warpages of both IC packages.
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spelling pubmed-82698812021-07-10 Thermally-Induced Deformations and Warpages of Flip-Chip and 2.5D IC Packages Measured by Strain Gauges Tsai, Ming-Yi Wang, Yu-Wen Liu, Chia-Ming Materials (Basel) Article The thermal warpage problems in integrated circuit (IC) packaging exist in both flip-chip and two-and-a-half dimensional integrated circuits (2.5D IC) packages during manufacturing processes and thermal cycling service. This study proposes a simple and easy-to-use strain gauge measurement associated with a beam model theory to determine the thermally induced deformations and warpages of both packages. First, validation and limitations of the beam model theory are presented. Then, the thermally induced out-of-plane deformations for both packages are well described by the finite element method (FEM) simulation with a good consistency to full-field shadow moiré experimental results. The strain gauge measurements were implemented experimentally, and the thermal strain results were found to be well consistent with validated FEM ones. As a result, out-of-plane thermal deformations and warpages of the packages, calculated from the beam model theory with extracted curvature data from the strain gauge, were in reasonably good agreement with those from FEM analysis and shadow moiré measurements. Therefore, the strain gauge method of featuring point strain measurement combined with the beam model theory proved feasible in determining the thermal deformations and warpages of both IC packages. MDPI 2021-07-02 /pmc/articles/PMC8269881/ /pubmed/34279290 http://dx.doi.org/10.3390/ma14133723 Text en © 2021 by the authors. https://creativecommons.org/licenses/by/4.0/Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Tsai, Ming-Yi
Wang, Yu-Wen
Liu, Chia-Ming
Thermally-Induced Deformations and Warpages of Flip-Chip and 2.5D IC Packages Measured by Strain Gauges
title Thermally-Induced Deformations and Warpages of Flip-Chip and 2.5D IC Packages Measured by Strain Gauges
title_full Thermally-Induced Deformations and Warpages of Flip-Chip and 2.5D IC Packages Measured by Strain Gauges
title_fullStr Thermally-Induced Deformations and Warpages of Flip-Chip and 2.5D IC Packages Measured by Strain Gauges
title_full_unstemmed Thermally-Induced Deformations and Warpages of Flip-Chip and 2.5D IC Packages Measured by Strain Gauges
title_short Thermally-Induced Deformations and Warpages of Flip-Chip and 2.5D IC Packages Measured by Strain Gauges
title_sort thermally-induced deformations and warpages of flip-chip and 2.5d ic packages measured by strain gauges
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8269881/
https://www.ncbi.nlm.nih.gov/pubmed/34279290
http://dx.doi.org/10.3390/ma14133723
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