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Thermally-Induced Deformations and Warpages of Flip-Chip and 2.5D IC Packages Measured by Strain Gauges
The thermal warpage problems in integrated circuit (IC) packaging exist in both flip-chip and two-and-a-half dimensional integrated circuits (2.5D IC) packages during manufacturing processes and thermal cycling service. This study proposes a simple and easy-to-use strain gauge measurement associated...
| Autores principales: | , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
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MDPI
2021
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| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8269881/ https://www.ncbi.nlm.nih.gov/pubmed/34279290 http://dx.doi.org/10.3390/ma14133723 |