Improved Mounting of Strain Sensors by Reactive Bonding

Aim of this work is to improve the bond between a strain sensor and a device on which the strain shall be determined. As strain sensor, a CMOS-integrated chip featuring piezoresistive sensor elements was used which is capable of wireless energy and data transmission. The sensor chip was mounted on a...

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Detalles Bibliográficos
Autores principales: Schumacher, Axel, Shah, Vraj, Steckemetz, Stefan, Dietrich, Georg, Pflug, Erik, Hehn, Thorsten, Knappmann, Stephan, Dehé, Alfons, Leson, Andreas
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Springer US 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8288070/
https://www.ncbi.nlm.nih.gov/pubmed/34305376
http://dx.doi.org/10.1007/s11665-021-05993-w

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8288070/
https://www.ncbi.nlm.nih.gov/pubmed/34305376
http://dx.doi.org/10.1007/s11665-021-05993-w

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