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Improved Mounting of Strain Sensors by Reactive Bonding
Aim of this work is to improve the bond between a strain sensor and a device on which the strain shall be determined. As strain sensor, a CMOS-integrated chip featuring piezoresistive sensor elements was used which is capable of wireless energy and data transmission. The sensor chip was mounted on a...
| Autores principales: | , , , , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Springer US
2021
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8288070/ https://www.ncbi.nlm.nih.gov/pubmed/34305376 http://dx.doi.org/10.1007/s11665-021-05993-w |