Geometrical Effects on Ultrasonic Al Bump Direct Bonding for Microsystem Integration: Simulation and Experiments

This study employed finite element analysis to simulate ultrasonic metal bump direct bonding. The stress distribution on bonding interfaces in metal bump arrays made of Al, Cu, and Ni/Pd/Au was simulated by adjusting geometrical parameters of the bumps, including the shape, size, and height; the bon...

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Detalles Bibliográficos
Autores principales: Lee, Jun-Hao, Li, Pin-Kuan, Hung, Hai-Wen, Chuang, Wallace, Schellkes, Eckart, Yasuda, Kiyokazu, Song, Jenn-Ming
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8303802/
https://www.ncbi.nlm.nih.gov/pubmed/34206756
http://dx.doi.org/10.3390/mi12070750

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8303802/
https://www.ncbi.nlm.nih.gov/pubmed/34206756
http://dx.doi.org/10.3390/mi12070750

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