Effect of Small Amount of Ni Addition on Microstructure and Fatigue Properties of Sn-Sb-Ag Lead-Free Solder

The effect of the addition volume of Ni on the microstructures and tensile and fatigue properties of Sn-6.4Sb-3.9Ag (mass%) was investigated using micro-size specimens. The addition of Ni into Sn-6.4Sb-3.9Ag tends to increase the number of grains formed in the solidification process and produce a hi...

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Detalles Bibliográficos
Autores principales: Yamamoto, Mizuki, Shohji, Ikuo, Kobayashi, Tatsuya, Mitsui, Kohei, Watanabe, Hirohiko
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8307275/
https://www.ncbi.nlm.nih.gov/pubmed/34300718
http://dx.doi.org/10.3390/ma14143799

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8307275/
https://www.ncbi.nlm.nih.gov/pubmed/34300718
http://dx.doi.org/10.3390/ma14143799

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