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Effect of Small Amount of Ni Addition on Microstructure and Fatigue Properties of Sn-Sb-Ag Lead-Free Solder

The effect of the addition volume of Ni on the microstructures and tensile and fatigue properties of Sn-6.4Sb-3.9Ag (mass%) was investigated using micro-size specimens. The addition of Ni into Sn-6.4Sb-3.9Ag tends to increase the number of grains formed in the solidification process and produce a hi...

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Detalles Bibliográficos
Autores principales:	Yamamoto, Mizuki, Shohji, Ikuo, Kobayashi, Tatsuya, Mitsui, Kohei, Watanabe, Hirohiko
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2021
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8307275/ https://www.ncbi.nlm.nih.gov/pubmed/34300718 http://dx.doi.org/10.3390/ma14143799

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