Joining of Electrodes to Ultra-Thin Metallic Layers on Ceramic Substrates in Cryogenic Sensors †

Microjoining technologies are crucial for producing reliable electrical connections in modern microelectronic and optoelectronic devices, as well as for the assembly of electronic circuits, sensors, and batteries. However, the production of miniature sensors presents particular difficulties, due to...

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Detalles Bibliográficos
Autores principales: Lebioda, Marcin, Pawlak, Ryszard, Rymaszewski, Jacek
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8309728/
https://www.ncbi.nlm.nih.gov/pubmed/34300659
http://dx.doi.org/10.3390/s21144919

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8309728/
https://www.ncbi.nlm.nih.gov/pubmed/34300659
http://dx.doi.org/10.3390/s21144919

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