Epoxy Composites with High Thermal Conductivity by Constructing Three-Dimensional Carbon Fiber/Carbon/Nickel Networks Using an Electroplating Method

[Image: see text] Heat dissipation problem is the primary factor restricting the service life of an electronic component. The thermal conductivity of materials has become a bottleneck that hinders the development of the electronic information industry (such as light-emitting diodes, 5G mobile phones...

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Detalles Bibliográficos
Autores principales: Wang, Ying, Tang, Bo, Gao, Yuan, Wu, Xinfeng, Chen, Jin, Shan, Liming, Sun, Kai, Zhao, Yuantao, Yang, Ke, Yu, Jinhong, Li, Wenge
Formato: Online Artículo Texto
Lenguaje:English
Publicado: American Chemical Society 2021
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8320143/
https://www.ncbi.nlm.nih.gov/pubmed/34337262
http://dx.doi.org/10.1021/acsomega.1c02694

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8320143/
https://www.ncbi.nlm.nih.gov/pubmed/34337262
http://dx.doi.org/10.1021/acsomega.1c02694

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