Reversible polymer-gel transition for ultra-stretchable chip-integrated circuits through self-soldering and self-coating and self-healing

Integration of solid-state microchips into soft-matter, and stretchable printed electronics has been the biggest challenge against their scalable fabrication. We introduce, Pol-Gel, a simple technique for self-soldering, self-encapsulation, and self-healing, that allows low cost, scalable, and rapid...

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Detalles Bibliográficos
Autores principales: Lopes, Pedro Alhais, Santos, Bruno C., de Almeida, Anibal T., Tavakoli, Mahmoud
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8333313/
https://www.ncbi.nlm.nih.gov/pubmed/34344880
http://dx.doi.org/10.1038/s41467-021-25008-5

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8333313/
https://www.ncbi.nlm.nih.gov/pubmed/34344880
http://dx.doi.org/10.1038/s41467-021-25008-5

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