In-situ study of electrochemical migration of tin in the presence of bromide ion

The miniaturization of electronic devices and the consequent decrease in the distance between conductive lines have increased the risk of short circuit failure due to electrochemical migration (ECM). The presence of ionic contaminants affects the ECM process. This work systematically investigates th...

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Detalles Bibliográficos
Autores principales: Lee, Ee Lynn, Haseeb, A. S. M. A., Basirun, Wan Jeffrey, Wong, Yew Hoong, Sabri, Mohd Faizul Mohd, Low, Boon Yew
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8333333/
https://www.ncbi.nlm.nih.gov/pubmed/34344974
http://dx.doi.org/10.1038/s41598-021-95276-0

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8333333/
https://www.ncbi.nlm.nih.gov/pubmed/34344974
http://dx.doi.org/10.1038/s41598-021-95276-0

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