Improvement Prediction on the Dynamic Performance of Epoxy Composite Used in Packaging by Using Nano-Particle Reinforcements in Addition to 2-Hydroxyethyl Methacrylate Toughener

Epoxy with low viscosity and good fluidity before curing has been widely applied in the packaging of electronic and electrical devices. Nevertheless, its low flexibility and toughness renders the requirement of property improvement before it can be widely acceptable in dynamic loading applications....

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Detalles Bibliográficos
Autores principales: Chen, Chih-Ming, Chang, Huey-Ling, Lee, Chun-Ying
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8347207/
https://www.ncbi.nlm.nih.gov/pubmed/34361387
http://dx.doi.org/10.3390/ma14154193

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8347207/
https://www.ncbi.nlm.nih.gov/pubmed/34361387
http://dx.doi.org/10.3390/ma14154193

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