Interdiffusion and Intermetallic Compounds at Al/Cu Interfaces in Al-50vol.%Cu Composite Prepared by Solid-State Sintering

Al–Cu composites have attracted significant interest recently owing to their lightweight nature and remarkable thermal properties. Understanding the interdiffusion mechanism at the numerous Al/Cu interfaces is crucial to obtain Al–Cu composites with high thermal conductivities. The present study sys...

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Detalles Bibliográficos
Autores principales: Kim, Dasom, Kim, Kyungju, Kwon, Hansang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8347343/
https://www.ncbi.nlm.nih.gov/pubmed/34361501
http://dx.doi.org/10.3390/ma14154307

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8347343/
https://www.ncbi.nlm.nih.gov/pubmed/34361501
http://dx.doi.org/10.3390/ma14154307

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