Accelerated reliability testing of Cu-Al bimetallic contact by a micropattern corrosion testing platform for wire bond device application

Accelerated reliability testing of integrated circuit (IC) packages, such as wire-bonded devices, is a useful tool for predicting the lifetime corrosion behavior of real-world devices. Standard tests, such as highly accelerated stress test, involves subjecting an encapsulated device to high levels o...

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Detalles Bibliográficos
Autores principales: Ashok Kumar, Goutham Issac, Alptekin, John, Caperton, Joshua, Salunke, Ashish, Chyan, Oliver
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Elsevier 2021
Materias:
Method Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8374339/
https://www.ncbi.nlm.nih.gov/pubmed/34434838
http://dx.doi.org/10.1016/j.mex.2021.101320

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8374339/
https://www.ncbi.nlm.nih.gov/pubmed/34434838
http://dx.doi.org/10.1016/j.mex.2021.101320

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