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Aluminum Nitride to Silicon Direct Bonding for an Alternative Silicon-On-Insulator Platform
[Image: see text] The next generation of microelectromechanical systems (MEMS) requires new materials and platforms that can exploit the intrinsic properties of advanced materials and structures, such as materials with high thermal conductivity, broad optical transmission spectra, piezoelectric prop...
| Autores principales: | , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
American Chemical Society
2021
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| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8397240/ https://www.ncbi.nlm.nih.gov/pubmed/34347425 http://dx.doi.org/10.1021/acsami.1c09535 |