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Aluminum Nitride to Silicon Direct Bonding for an Alternative Silicon-On-Insulator Platform

[Image: see text] The next generation of microelectromechanical systems (MEMS) requires new materials and platforms that can exploit the intrinsic properties of advanced materials and structures, such as materials with high thermal conductivity, broad optical transmission spectra, piezoelectric prop...

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Detalles Bibliográficos
Autores principales:	Kaaos, Jani, Ross, Glenn, Paulasto-Kröckel, Mervi
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	American Chemical Society 2021
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8397240/ https://www.ncbi.nlm.nih.gov/pubmed/34347425 http://dx.doi.org/10.1021/acsami.1c09535

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