Embedding of Ultrathin Chips in Highly Flexible, Photosensitive Solder Mask Resist

This work presents an embedding process for ultrathin silicon chips in mechanically flexible solder mask resist and their electrical contacting by inkjet printing. Photosensitive solder mask resist is applied by conformal spray coating onto epoxy bonded ultrathin chips with a daisy chain layout. The...

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Detalles Bibliográficos
Autores principales: Janek, Florian, Eichhorn, Nadine, Weser, Sascha, Gläser, Kerstin, Eberhardt, Wolfgang, Zimmermann, André
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8398422/
https://www.ncbi.nlm.nih.gov/pubmed/34442478
http://dx.doi.org/10.3390/mi12080856

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8398422/
https://www.ncbi.nlm.nih.gov/pubmed/34442478
http://dx.doi.org/10.3390/mi12080856

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