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Embedding of Ultrathin Chips in Highly Flexible, Photosensitive Solder Mask Resist
This work presents an embedding process for ultrathin silicon chips in mechanically flexible solder mask resist and their electrical contacting by inkjet printing. Photosensitive solder mask resist is applied by conformal spray coating onto epoxy bonded ultrathin chips with a daisy chain layout. The...
| Autores principales: | , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2021
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8398422/ https://www.ncbi.nlm.nih.gov/pubmed/34442478 http://dx.doi.org/10.3390/mi12080856 |