Seedless Cu Electroplating on Co-W Thin Films in Low pH Electrolyte: Early Stages of Formation

The use of Ta/TaN barrier bilayer systems in electronic applications has been ubiquitous over the last decade. Alternative materials such as Co-W or Ru-W alloys have gathered interest as possible replacements due to their conjugation of favourable electrical properties and barrier layer efficiency a...

Descripción completa

Detalles Bibliográficos
Autores principales: Santos, Rúben F., Oliveira, Bruno M. C., Chícharo, Alexandre, Alpuim, Pedro, Ferreira, Paulo J., Simões, Sónia, Viana, Filomena, Vieira, Manuel F.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8398599/
https://www.ncbi.nlm.nih.gov/pubmed/34443745
http://dx.doi.org/10.3390/nano11081914

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8398599/
https://www.ncbi.nlm.nih.gov/pubmed/34443745
http://dx.doi.org/10.3390/nano11081914

Ejemplares similares