Implementation and Performance Evaluation of a Bivariate Cut-HDMR Metamodel for Semiconductor Packaging Design Problems with a Large Number of Input Variables

A metamodeling technique based on Bivariate Cut High Dimensional Model Representation (Bivariate Cut HDMR) is implemented for a semiconductor packaging design problem with 10 design variables. Bivariate Cut-HDMR constructs a metamodel by considering only up to second-order interactions. The implemen...

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Detalles Bibliográficos
Autores principales: Yang, Yu-Hsiang, Wei, Hsiu-Ping, Han, Bongtae, Hu, Chao
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8400015/
https://www.ncbi.nlm.nih.gov/pubmed/34443148
http://dx.doi.org/10.3390/ma14164619

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8400015/
https://www.ncbi.nlm.nih.gov/pubmed/34443148
http://dx.doi.org/10.3390/ma14164619

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