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Implementation and Performance Evaluation of a Bivariate Cut-HDMR Metamodel for Semiconductor Packaging Design Problems with a Large Number of Input Variables
A metamodeling technique based on Bivariate Cut High Dimensional Model Representation (Bivariate Cut HDMR) is implemented for a semiconductor packaging design problem with 10 design variables. Bivariate Cut-HDMR constructs a metamodel by considering only up to second-order interactions. The implemen...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2021
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8400015/ https://www.ncbi.nlm.nih.gov/pubmed/34443148 http://dx.doi.org/10.3390/ma14164619 |