Mechanical Durability of Flexible Printed Circuit Boards Containing Thin Coverlays Fabricated with Poly(Amide-Imide-Urethane)/Epoxy Interpenetrating Networks

Because electronics are becoming flexible, the demand for techniques to manufacture thin flexible printed circuit boards (FPCBs) has increased. Conventional FPCBs are fabricated by attaching a coverlay film (41 μm) onto copper patterns/polyimide (PI) film to produce the structure of coverlay/Cu patt...

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Detalles Bibliográficos
Autores principales: Kim, Jeongah, Kim, Bo-Young, Park, Seong Dae, Seo, Ji-Hun, Lee, Chan-Jae, Yoo, Myong Jae, Kim, Youngmin
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8400115/
https://www.ncbi.nlm.nih.gov/pubmed/34442565
http://dx.doi.org/10.3390/mi12080943

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8400115/
https://www.ncbi.nlm.nih.gov/pubmed/34442565
http://dx.doi.org/10.3390/mi12080943

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