Semiconductor Chip Electrical Interconnection and Bonding by Nano-Locking with Ultra-Fine Bond-Line Thickness

The potential of an innovation for establishing a simultaneous mechanical, thermal, and electrical connection between two metallic surfaces without requiring a prior time-consuming and expensive surface nanoscopic planarization and without requiring any intermediate conductive material has been expl...

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Detalles Bibliográficos
Autores principales: Guo, Jielin, Shih, Yu-Chou, Sheikhi, Roozbeh, You, Jiun-Pyng, Shi, Frank G.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8401537/
https://www.ncbi.nlm.nih.gov/pubmed/34443732
http://dx.doi.org/10.3390/nano11081901

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8401537/
https://www.ncbi.nlm.nih.gov/pubmed/34443732
http://dx.doi.org/10.3390/nano11081901

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