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Semiconductor Chip Electrical Interconnection and Bonding by Nano-Locking with Ultra-Fine Bond-Line Thickness
The potential of an innovation for establishing a simultaneous mechanical, thermal, and electrical connection between two metallic surfaces without requiring a prior time-consuming and expensive surface nanoscopic planarization and without requiring any intermediate conductive material has been expl...
| Autores principales: | , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2021
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8401537/ https://www.ncbi.nlm.nih.gov/pubmed/34443732 http://dx.doi.org/10.3390/nano11081901 |