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Theoretical and Experimental Investigation of Warpage Evolution of Flip Chip Package on Packaging during Fabrication
This study attempts to investigate the warpage behavior of a flip chip package-on-package (FCPoP) assembly during fabrication process. A process simulation framework that integrates thermal and mechanical finite element analysis (FEA), effective modeling and ANSYS element death-birth technique is in...
Autores principales: | , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2021
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8432544/ https://www.ncbi.nlm.nih.gov/pubmed/34500909 http://dx.doi.org/10.3390/ma14174816 |