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Theoretical and Experimental Investigation of Warpage Evolution of Flip Chip Package on Packaging during Fabrication

This study attempts to investigate the warpage behavior of a flip chip package-on-package (FCPoP) assembly during fabrication process. A process simulation framework that integrates thermal and mechanical finite element analysis (FEA), effective modeling and ANSYS element death-birth technique is in...

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Detalles Bibliográficos
Autores principales:	Cheng, Hsien-Chie, Tai, Ling-Ching, Liu, Yan-Cheng
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2021
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8432544/ https://www.ncbi.nlm.nih.gov/pubmed/34500909 http://dx.doi.org/10.3390/ma14174816

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