Solder Joint Reliability Risk Estimation by AI-Assisted Simulation Framework with Genetic Algorithm to Optimize the Initial Parameters for AI Models

Solder joint fatigue is one of the critical failure modes in ball-grid array packaging. Because the reliability test is time-consuming and geometrical/material nonlinearities are required for the physics-driven model, the AI-assisted simulation framework is developed to establish the risk estimation...

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Detalles Bibliográficos
Autores principales: Yuan, Cadmus, Fan, Xuejun, Zhang, Gouqi
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8432715/
https://www.ncbi.nlm.nih.gov/pubmed/34500925
http://dx.doi.org/10.3390/ma14174835

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8432715/
https://www.ncbi.nlm.nih.gov/pubmed/34500925
http://dx.doi.org/10.3390/ma14174835

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