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Solder Joint Reliability Risk Estimation by AI-Assisted Simulation Framework with Genetic Algorithm to Optimize the Initial Parameters for AI Models
Solder joint fatigue is one of the critical failure modes in ball-grid array packaging. Because the reliability test is time-consuming and geometrical/material nonlinearities are required for the physics-driven model, the AI-assisted simulation framework is developed to establish the risk estimation...
| Autores principales: | , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
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MDPI
2021
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| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8432715/ https://www.ncbi.nlm.nih.gov/pubmed/34500925 http://dx.doi.org/10.3390/ma14174835 |