Methods for latent image simulations in photolithography with a polychromatic light attenuation equation for fabricating VIAs in 2.5D and 3D advanced packaging architectures

As demand accelerates for multifunctional devices with a small footprint and minimal power consumption, 2.5D and 3D advanced packaging architectures have emerged as an essential solution that use through-substrate vias (TSVs) as vertical interconnects. Vertical stacking enables chip packages with in...

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Detalles Bibliográficos
Autores principales: Smallwood, Daniel C., McCloskey, Paul, O’Mathuna, Cian, Casey, Declan P., Rohan, James F.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8433293/
https://www.ncbi.nlm.nih.gov/pubmed/34567753
http://dx.doi.org/10.1038/s41378-021-00266-x

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8433293/
https://www.ncbi.nlm.nih.gov/pubmed/34567753
http://dx.doi.org/10.1038/s41378-021-00266-x

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