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Investigation of a complete squeeze-film damping model for MEMS devices
Dynamic performance has long been critical for micro-electro-mechanical system (MEMS) devices and is significantly affected by damping. Different structural vibration conditions lead to different damping effects, including border and amplitude effects, which represent the effect of gas flowing aroun...
Autores principales: | , , , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
Nature Publishing Group UK
2021
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8433295/ https://www.ncbi.nlm.nih.gov/pubmed/34567767 http://dx.doi.org/10.1038/s41378-021-00279-6 |
Sumario: | Dynamic performance has long been critical for micro-electro-mechanical system (MEMS) devices and is significantly affected by damping. Different structural vibration conditions lead to different damping effects, including border and amplitude effects, which represent the effect of gas flowing around a complicated boundary of a moving plate and the effect of a large vibration amplitude, respectively. Conventional models still lack a complete understanding of damping and cannot offer a reasonably good estimate of the damping coefficient for a case with both effects. Expensive efforts have been undertaken to consider these two effects, yet a complete model has remained elusive. This paper investigates the dynamic performance of vibrated structures via theoretical and numerical methods simultaneously, establishing a complete model in consideration of both effects in which the analytical expression is given, and demonstrates a deviation of at least threefold lower than current studies by simulation and experimental results. This complete model is proven to successfully characterize the squeeze-film damping and dynamic performance of oscillators under comprehensive conditions. Moreover, a series of simulation models with different dimensions and vibration statuses are introduced to obtain a quick-calculating factor of the damping coefficient, thus offering a previously unattainable damping design guide for MEMS devices. |
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