Vertical integration of microchips by magnetic assembly and edge wire bonding

The out-of-plane integration of microfabricated planar microchips into functional three-dimensional (3D) devices is a challenge in various emerging MEMS applications such as advanced biosensors and flow sensors. However, no conventional approach currently provides a versatile solution to vertically...

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Detalles Bibliográficos
Autores principales: Ribet, Federico, Wang, Xiaojing, Laakso, Miku, Pagliano, Simone, Niklaus, Frank, Roxhed, Niclas, Stemme, Göran
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2020
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8433299/
https://www.ncbi.nlm.nih.gov/pubmed/34567627
http://dx.doi.org/10.1038/s41378-019-0126-6

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8433299/
https://www.ncbi.nlm.nih.gov/pubmed/34567627
http://dx.doi.org/10.1038/s41378-019-0126-6

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