Wafer-scale 3D shaping of high aspect ratio structures by multistep plasma etching and corner lithography

The current progress of system miniaturization relies extensively on the development of 3D machining techniques to increase the areal structure density. In this work, a wafer-scale out-of-plane 3D silicon (Si) shaping technology is reported, which combines a multistep plasma etching process with cor...

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Detalles Bibliográficos
Autores principales: Ni, Shu, Berenschot, Erwin J. W., Westerik, Pieter J., de Boer, Meint J., Wolf, René, Le-The, Hai, Gardeniers, Han J. G. E., Tas, Niels R.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2020
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8433478/
https://www.ncbi.nlm.nih.gov/pubmed/34567640
http://dx.doi.org/10.1038/s41378-020-0134-6

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8433478/
https://www.ncbi.nlm.nih.gov/pubmed/34567640
http://dx.doi.org/10.1038/s41378-020-0134-6

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