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Characterization of SiO(2) Etching Profiles in Pulse-Modulated Capacitively Coupled Plasmas
Although pulse-modulated plasma has overcome various problems encountered during the development of the high aspect ratio contact hole etching process, there is still a lack of understanding in terms of precisely how the pulse-modulated plasma solves the issues. In this research, to gain insight int...
Autores principales: | , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2021
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8434144/ https://www.ncbi.nlm.nih.gov/pubmed/34501123 http://dx.doi.org/10.3390/ma14175036 |