Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealing

This manuscript reports the isothermal annealing effect on the mechanical and microstructure characteristics of Sn-0.7Cu-1.5Bi solder joints. A detailed microstructure observation was carried out, including measuring the activation energy of the intermetallic compound (IMC) layer of the solder joint...

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Detalles Bibliográficos
Autores principales: Ramli, Mohd Izrul Izwan, Salleh, Mohd Arif Anuar Mohd, Sandu, Andrei Victor, Amli, Siti Farahnabilah Muhd, Said, Rita Mohd, Saud, Norainiza, Abdullah, Mohd Mustafa Al Bakri, Vizureanu, Petrica, Rylski, Adam, Chaiprapa, Jitrin, Nabialek, Marcin
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8464684/
https://www.ncbi.nlm.nih.gov/pubmed/34576358
http://dx.doi.org/10.3390/ma14185134

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8464684/
https://www.ncbi.nlm.nih.gov/pubmed/34576358
http://dx.doi.org/10.3390/ma14185134

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