On the Electrochemical Migration Mechanism of Gold in Electronics—Less Reliable Than Expected?

Electrochemical migration (ECM) forming dendritic short circuits is a major reliability limiting factor in microcircuits. Gold, which is a noble metal, has been regarded as a metallization that can withstand corrosion and also ECM, therefore its application in high-reliability metallization and surf...

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Detalles Bibliográficos
Autores principales: Medgyes, Bálint, Gharaibeh, Ali, Rigler, Dániel, Harsányi, Gábor
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8465352/
https://www.ncbi.nlm.nih.gov/pubmed/34576462
http://dx.doi.org/10.3390/ma14185237

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8465352/
https://www.ncbi.nlm.nih.gov/pubmed/34576462
http://dx.doi.org/10.3390/ma14185237

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