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On the Electrochemical Migration Mechanism of Gold in Electronics—Less Reliable Than Expected?
Electrochemical migration (ECM) forming dendritic short circuits is a major reliability limiting factor in microcircuits. Gold, which is a noble metal, has been regarded as a metallization that can withstand corrosion and also ECM, therefore its application in high-reliability metallization and surf...
| Autores principales: | , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
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MDPI
2021
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8465352/ https://www.ncbi.nlm.nih.gov/pubmed/34576462 http://dx.doi.org/10.3390/ma14185237 |