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Three-Dimensional Finite Element Analysis and Characterization of Quasi-Surface Acoustic Wave Resonators
In this work, three-dimensional finite element analysis (3D FEA) of quasi-surface acoustic wave (QSAW) resonators with high accuracy is reported. The QSAW resonators consist of simple molybdenum (Mo) interdigitated transducers (IDT) on solidly mounted stacked layers of AlN/Mo/Si. Different to the SA...
Autores principales: | , , , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2021
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8472577/ https://www.ncbi.nlm.nih.gov/pubmed/34577761 http://dx.doi.org/10.3390/mi12091118 |
Sumario: | In this work, three-dimensional finite element analysis (3D FEA) of quasi-surface acoustic wave (QSAW) resonators with high accuracy is reported. The QSAW resonators consist of simple molybdenum (Mo) interdigitated transducers (IDT) on solidly mounted stacked layers of AlN/Mo/Si. Different to the SAW resonators operating in the piezoelectric substrates, the reported resonators are operating in the QSAW mode, since the IDT-excited Rayleigh waves not only propagate in the thin piezoelectric layer of AlN, but also penetrate the Si substrate. Compared with the commonly used two-dimensional (2D) FEA approach, the 3D FEA method reported in this work shows high accuracy, in terms of the resonant frequency, temperature coefficient of frequency ([Formula: see text]), effective coupling coefficient ([Formula: see text]) and frequency response. The fabricated QSAW resonator has demonstrated a [Formula: see text] of 0.291%, series resonant frequency of 422.50 MHz, and [Formula: see text] of −23.418 ppm/°C in the temperature range between 30 °C and 150 °C, for the design of wavelength at 10.4 [Formula: see text] m. The measurement results agree well with the simulations. Moreover, the QSAW resonators are more mechanically robust than lamb wave devices and can be integrated with silicon-based film bulk acoustic resonator (FBAR) devices to offer multi-frequency function in a single chip. |
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