Revealing the High-Modulus Mechanism of Polyimide Films Prepared with 3,4′-ODA

To prepare PIs (polyimides) with desirable thermal and mechanical properties is highly demanded due to their widespread applications in flexible optoelectronic devices and printed circuit boards. Here, the PI films of BPDA/4,4′-ODA, BPDA/3,4′-ODA, PMDA/4,4′-ODA, PMDA/3,4′-ODA systems were prepared,...

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Detalles Bibliográficos
Autores principales: Zhu, Li, Li, Yinong, Han, Shuhao, Niu, Hongqing, Wu, Dezhen, Qi, Shengli
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8473375/
https://www.ncbi.nlm.nih.gov/pubmed/34578077
http://dx.doi.org/10.3390/polym13183175

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8473375/
https://www.ncbi.nlm.nih.gov/pubmed/34578077
http://dx.doi.org/10.3390/polym13183175

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