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Revealing the High-Modulus Mechanism of Polyimide Films Prepared with 3,4′-ODA
To prepare PIs (polyimides) with desirable thermal and mechanical properties is highly demanded due to their widespread applications in flexible optoelectronic devices and printed circuit boards. Here, the PI films of BPDA/4,4′-ODA, BPDA/3,4′-ODA, PMDA/4,4′-ODA, PMDA/3,4′-ODA systems were prepared,...
| Autores principales: | , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2021
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8473375/ https://www.ncbi.nlm.nih.gov/pubmed/34578077 http://dx.doi.org/10.3390/polym13183175 |