Effects of Deep Cryogenic Treatment on the Microstructure and Properties of Rolled Cu Foil

The development of fifth-generation (5G) communication and wearable electronics generates higher requirements for the mechanical properties of copper foil. Higher mechanical properties and lower resistance are required for flexible copper-clad laminate and high-frequency and high-speed Cu foil. Deep...

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Detalles Bibliográficos
Autores principales: Dong, Zhichao, Fei, Xiangyu, Gong, Benkui, Zhao, Xinyu, Nie, Jiwei
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8509810/
https://www.ncbi.nlm.nih.gov/pubmed/34639896
http://dx.doi.org/10.3390/ma14195498

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8509810/
https://www.ncbi.nlm.nih.gov/pubmed/34639896
http://dx.doi.org/10.3390/ma14195498

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