Investigation of Adhesive’s Material in Hermetic MEMS Package for Interfacial Crack between the Silver Epoxy and the Metal Lid during the Precondition Test

A hermetic Micro-Electro-Mechanical Systems (MEMS) package with a metal lid is investigated to prevent lid-off failure and improve its reliability during the precondition test. While the MEMS package benefits from miniaturization and low cost, a hermetic version is highly sensitive to internal press...

Descripción completa

Detalles Bibliográficos
Autores principales: Wu, Mei-Ling, Lan, Jia-Shen
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8510222/
https://www.ncbi.nlm.nih.gov/pubmed/34640014
http://dx.doi.org/10.3390/ma14195626

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8510222/
https://www.ncbi.nlm.nih.gov/pubmed/34640014
http://dx.doi.org/10.3390/ma14195626

Ejemplares similares