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Investigation of Adhesive’s Material in Hermetic MEMS Package for Interfacial Crack between the Silver Epoxy and the Metal Lid during the Precondition Test
A hermetic Micro-Electro-Mechanical Systems (MEMS) package with a metal lid is investigated to prevent lid-off failure and improve its reliability during the precondition test. While the MEMS package benefits from miniaturization and low cost, a hermetic version is highly sensitive to internal press...
| Autores principales: | , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
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MDPI
2021
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| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8510222/ https://www.ncbi.nlm.nih.gov/pubmed/34640014 http://dx.doi.org/10.3390/ma14195626 |