Boron Nitride-Filled Linear Low-Density Polyethylene for Enhanced Thermal Transport: Continuous Extrusion of Micro-Textured Films

With shrinking size of electronic devices, increasing performance and accompanying heat dissipation, there is a need for efficient removal of this heat through packaging materials. Polymer materials are attractive packaging materials given their low density and electrical insulating properties, but...

Descripción completa

Detalles Bibliográficos
Autores principales: Güzdemir, Özgün, Kanhere, Sagar, Bermudez, Victor, Ogale, Amod A.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8512164/
https://www.ncbi.nlm.nih.gov/pubmed/34641208
http://dx.doi.org/10.3390/polym13193393

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8512164/
https://www.ncbi.nlm.nih.gov/pubmed/34641208
http://dx.doi.org/10.3390/polym13193393

Ejemplares similares