Recent Advances on Thermally Conductive Adhesive in Electronic Packaging: A Review

The application of epoxy adhesive is widespread in electronic packaging. Epoxy adhesives can be integrated with various types of nanoparticles for enhancing thermal conductivity. The joints with thermally conductive adhesive (TCA) are preferred for research and advances in thermal management. Many s...

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Detalles Bibliográficos
Autores principales: Alim, Md. Abdul, Abdullah, Mohd Zulkifly, Aziz, Mohd Sharizal Abdul, Kamarudin, R., Gunnasegaran, Prem
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Review
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8512300/
https://www.ncbi.nlm.nih.gov/pubmed/34641155
http://dx.doi.org/10.3390/polym13193337

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8512300/
https://www.ncbi.nlm.nih.gov/pubmed/34641155
http://dx.doi.org/10.3390/polym13193337

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