Fabrication of Al(2)O(3)/ZnO and Al(2)O(3)/Cu Reinforced Silicone Rubber Composite Pads for Thermal Interface Materials

Thermal interface materials (also known as thermal pads) are widely used as a crucial part to dissipate heat generated in miniaturized and integrated electronic components. Here, we systematically investigated the effects of small ceramic and metallic powders in rubbery thermal composite pads with a...

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Detalles Bibliográficos
Autores principales: Jang, Seokkyu, Choi, Eun Ji, Cheon, Han Jin, Choi, Won Il, Shin, Woon Seo, Lim, Jong-Min
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8513005/
https://www.ncbi.nlm.nih.gov/pubmed/34641076
http://dx.doi.org/10.3390/polym13193259

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8513005/
https://www.ncbi.nlm.nih.gov/pubmed/34641076
http://dx.doi.org/10.3390/polym13193259

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