Comparison between Bosch and STiGer Processes for Deep Silicon Etching

The cryogenic process is well known to etch high aspect ratio features in silicon with smooth sidewalls. A time-multiplexed cryogenic process, called STiGer, was developed in 2006 and patented. Like the Bosch process, it consists in repeating cycles composed of an isotropic etching step followed by...

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Detalles Bibliográficos
Autores principales: Tillocher, Thomas, Nos, Jack, Antoun, Gaëlle, Lefaucheux, Philippe, Boufnichel, Mohamed, Dussart, Rémi
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2021
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8537062/
https://www.ncbi.nlm.nih.gov/pubmed/34683193
http://dx.doi.org/10.3390/mi12101143

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC8537062/
https://www.ncbi.nlm.nih.gov/pubmed/34683193
http://dx.doi.org/10.3390/mi12101143

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